Qualcomm tests dual-carrier HSPA+, multi-mode 3G/LTE chipsets
12 November 2009
Qualcomm said that it is sampling the newly developed chipsets for dual-carrier HSPA+ and multi-mode 3G/LTE. The Mobile Data Modem MDM8220 supports dual-carrier high-speed packet access plus and the MDM9200 and the MDM9600 multi-mode chipsets 3G and Long Term Evolution (LTE).
